Next Generation 
Conductive Pastes

Boost Performance. Save Resources

👉We are now seeking a CFO to strengthen our team

Ready to rethink conductive pastes?
Electrical & thermal conductivity

Slash costs

Our technology enables direct cost savings by optimal material utilization

Maximize conductivty

High conductivity by new formulation method. Ready for high-performance applications

Plug & Play

Drop-in products for standard printing technologies

Universal Approach

We use a material-independent technology platform to create products for various industrial use cases, such as printed electronics, solar metallization and thermal interface materials. We maximize conductivity and reduce costs by using self-organizing particle network.

Close-up picture of a solar cell showing its finger lines and busbars
In-Mold Electronics IME showing printed conductive circuits on 3D-formed film embedded in injection molded plastic componen
3D printing process depositing conductive paste for electronic circuits.
A bent sheet of paper with a printed flexible conductor.

About Us

Our team from KIT combines research expertise with industrial focus. We are in pre-founding phase.

We are currently seeking a CFO as our fourth team member.

Contact Us

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Our Address

Max Ailinger

Gotthard-Franz-Straße 3
76131 Karlsruhe 
Germany

Phone: +49 721 608 43760
E-Mail: max.ailinger@kit.edu

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